XC7Z100-2FFG1156I vs XC7Z100-1FFG1156I

This detailed comparison of XC7Z100-2FFG1156I and XC7Z100-1FFG1156I in the Embedded - System On Chip (SoC) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC7Z100-2FFG1156I

XC7Z100-2FFG1156I

Xilinx

XC7Z100-1FFG1156I

XC7Z100-1FFG1156I

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 1156-BBGA, FCBGA 1156-BBGA, FCBGA
Description IC SOC CORTEX-A9 800MHZ 1156BGA IC SOC CORTEX-A9 667MHZ 1156BGA
In Stock 864 793
Mounting Type - -
Part Status Active Active
Series Zynq®-7000 Zynq®-7000
Package Tray Tray
Architecture MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size - -
RAM Size 256KB 256KB
Peripherals DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz 667MHz
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells Kintex™-7 FPGA, 444K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Supplier Device Package 1156-FCBGA (35x35) 1156-FCBGA (35x35)
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