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Type | Description |
---|---|
Series: | Tflex™ B200 |
Package: | Bulk |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Square |
Outline: | 228.60mm x 228.60mm |
Thickness: | 0.0400" (1.016mm) |
Material: | Silicone, Ceramic Filled |
Adhesive: | Tacky - Both Sides |
Backing, Carrier: | - |
Color: | Gray |
Thermal Resistivity: | - |
Thermal Conductivity: | 2.0W/m-K |
RES 9.88K OHM 0.05% 1/4W 1206
MEMS OSC XO 74.2500MHZ H/LV-CMOS
TFLEX B240 9X9IN
TVS DIODE 12V 19.9V PLAD