
| Type | Description |
|---|---|
| Series: | 514 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 478 (26 x 26) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 15 |
Current price of 514-83-478M26-131148 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
STANDRD SOLDRTL DBL SKT
CONN IC DIP SOCKET 42POS GOLD
CONN IC DIP SOCKET 28POS GOLD
XTAL OSC VCXO 148.5000MHZ LVDS
DC DC CONVERTER 3.4V 20W
CONN SOCKET BGA 478POS GOLD
DC DC CONVERTER 5V 400W