
| Type | Description |
|---|---|
| Series: | Lo-PRO®file, 526 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 17 |
Current price of 24-526-11 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 14POS GOLD
CONN SOCKET SIP 4POS GOLD
CONN IC SKT DBL
0805 ANTI-SULFUR RES. , 0.5%, 14
CONN IC DIP SOCKET ZIF 24POS GLD