
| Type | Description |
|---|---|
| Series: | 518 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 29 (1 x 29) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 41 |
Current price of 29-0518-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 50POS GOLD
SKT PGA SOLDRTL
CONN IC DIP SOCKET 32POS GOLD
RES SMD 470 OHM 5% 3.5W 2512
RES SMD 19.1 OHM 0.5% 1/8W 1206
CONN SOCKET SIP 29POS GOLD
CERAMIC RESONATOR 3.36MHZ T/H