
| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| Type: | LGA |
| Number of Positions or Pins (Grid): | 1366 (32 x 41) |
| Pitch - Mating: | 0.040" (1.02mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.040" (1.01mm) |
| Contact Finish - Post: | - |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | - |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 1-1981837-2 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 14POS GOLD
CONN SOCKET SIP 22POS GOLD
CONN IC DIP SOCKET 40POS GOLD
RES 1.21K OHM 1/2W 1% AXIAL
CONN HEADER VERT 10POS 2.54MM
CONN SOCKET 8POS 0.1 GOLD PCB
CONN SOCKET LGA 1366POS GOLD