
| Type | Description |
|---|---|
| Series: | - |
| Package: | Box |
| Part Status: | Active |
| Type: | Top Mount, Extrusion |
| Package Cooled: | - |
| Attachment Method: | Adhesive |
| Shape: | Rectangular, Fins |
| Length: | 48.032" (1220.00mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | - |
| Fin Height: | 0.157" (4.00mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 24.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 55.00°C/W |
| Material: | Aluminum |
| Material Finish: | Degreased |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 |
Current price of ATS-EXL66-1220-R0 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
BOARD LEVEL HEAT SINK
HEATSINK 40X40X25MM XCUT T766
HEATSINK FOR 25MM BGA
XTAL OSC VCXO 28.3750MHZ CMOS
SLDR SLV WIRE-WIRE 0.267/0.287"
HEATSINK AL6063 1220X25.4X4MM
ACTIVE 5X MULTIPLIERS