
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-5 |
| Attachment Method: | Press Fit |
| Shape: | Cylindrical |
| Length: | - |
| Width: | - |
| Diameter: | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD |
| Fin Height: | 0.400" (10.16mm) |
| Power Dissipation @ Temperature Rise: | 1.8W @ 50°C |
| Thermal Resistance @ Forced Air Flow: | 14.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 21.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 1500 |
Current price of 2227B is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
BOARD LEVEL HEATSINK .375" D2PAK
HEATSINK EXTRUDED
HEATSINK 40X40X25MM XCUT T766
RES 9.42K OHM 0.25% 1/10W 0603
CAP FILM 0.082UF 20% 1KVDC RAD
BOARD LEVEL HEAT SINK