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Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | - |
Package Cooled: | - |
Attachment Method: | - |
Shape: | - |
Length: | - |
Width: | - |
Diameter: | - |
Fin Height: | - |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | - |
Thermal Resistance @ Natural: | - |
Material: | - |
Material Finish: | - |
RES 681K OHM 1% 1/10W 0402
RES SMD 357K OHM 0.1% 0.4W 1206
RES 75 OHM 0.5% 1/8W 0805
HEAT SINK FOR TI MODULE #