
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | - |
| Package Cooled: | - |
| Attachment Method: | - |
| Shape: | - |
| Length: | - |
| Width: | - |
| Diameter: | - |
| Fin Height: | - |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | - |
| Material: | - |
| Material Finish: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 |
Current price of ATS-TI10P-525-C1-R0 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
HEATSINK 40X40X25MM L-TAB T766
10.78WX36" EXTRUSION XX4559
HEATSINK FOR 21MM BGA
RES 0.033 OHM 3.0 W 1% 2512 SMD
RES SMD 360K OHM 1% 1W MELF
CAP FILM 0.047UF 10% 400VDC RAD
HEAT SINK FOR TI MODULE #