This detailed comparison of 1SX250HU2F50E1VG and 1SX250HU1F50E2VG in the Embedded - System On Chip (SoC) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.
| Manufacturer | Intel | Intel |
|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | 2397-BBGA, FCBGA |
| Description | IC FPGA STRATIX 10 2397FBGA | IC FPGA STRATIX 10 2397FBGA |
| In Stock | 900 | 252 |
| Mounting Type | - | - |
| Part Status | Active | Active |
| Series | Stratix® 10 SX | Stratix® 10 SX |
| Package | Tray | Tray |
| Architecture | MCU, FPGA | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ |
| Flash Size | - | - |
| RAM Size | 256KB | 256KB |
| Peripherals | DMA, WDT | DMA, WDT |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1.5GHz | 1.5GHz |
| Primary Attributes | FPGA - 2500K Logic Elements | FPGA - 2500K Logic Elements |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
| Supplier Device Package | 2397-FBGA (50x50) | 2397-FBGA (50x50) |