AT91SAM7S64C-MU-999 vs LPC2132FHN64/01,55

This detailed comparison of AT91SAM7S64C-MU-999 and LPC2132FHN64/01,55 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

AT91SAM7S64C-MU-999

AT91SAM7S64C-MU-999

Roving Networks / Microchip Technology

LPC2132FHN64/01,55

LPC2132FHN64/01,55

NXP Semiconductors

Specifications
Manufacturer Roving Networks / Microchip Technology NXP Semiconductors
Package / Case 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad
Description IC MCU 16/32BIT 64KB FLASH 64QFN IC MCU 16/32B 64KB FLASH 64HVQFN
In Stock 1 426 0
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series SAM7S LPC2100
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tray
Core Processor ARM7® ARM7®
Core Size 16/32-Bit 16/32-Bit
Speed 55MHz 60MHz
Connectivity I²C, SPI, SSC, UART/USART, USB I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 32 47
Program Memory Size 64KB (64K x 8) 64KB (64K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V 3V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b; D/A 1x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-QFN (9x9) 64-HVQFN (9x9)
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