ATSAM3N1BB-AU vs TMPM383FWUG(JZ)

This detailed comparison of ATSAM3N1BB-AU and TMPM383FWUG(JZ) in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3N1BB-AU

Roving Networks / Microchip Technology

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TMPM383FWUG(JZ)

Toshiba Electronic Devices and Storage Corporation

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Toshiba Electronic Devices and Storage Corporation
Package / Case	64-LQFP	64-LQFP
Description	IC MCU 32BIT 64KB FLASH 64LQFP	IC MCU 32BIT 128KB FLASH 64LQFP
In Stock	109	1 600
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3N	TX03
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	48MHz	40MHz
Connectivity	I²C, IrDA, SPI, UART/USART	I²C, Microwire, SIO, SPI, SSI, SSP, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	POR, WDT
Number of I/O	47	47
Program Memory Size	64KB (64K x 8)	128KB (128K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	10K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	3.9V ~ 5.5V
Data Converters	A/D 10x10b; D/A 1x10b	A/D 10x12b
Oscillator Type	Internal	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-LQFP (10x10)	64-LQFP (10x10)