ATSAM3N1CB-CUR vs ATSAM3N4CA-CU

This detailed comparison of ATSAM3N1CB-CUR and ATSAM3N4CA-CU in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3N1CB-CUR

ATSAM3N1CB-CUR

Roving Networks / Microchip Technology

ATSAM3N4CA-CU

ATSAM3N4CA-CU

VIGOR

Specifications
Manufacturer Roving Networks / Microchip Technology VIGOR
Package / Case 100-TFBGA 100-TFBGA
Description IC MCU 32BIT 64KB FLASH 100TFBGA IC MCU 32BIT 256KB FLSH 100TFBGA
In Stock 2 893 4 973
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series SAM3N SAM3N
Package Tape & Reel (TR) Tray
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit 32-Bit
Speed 48MHz 48MHz
Connectivity I²C, IrDA, SPI, UART/USART I²C, IrDA, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 79 79
Program Memory Size 64KB (64K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 8K x 8 24K x 8
Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V 1.62V ~ 3.6V
Data Converters A/D 16x10b; D/A 1x10b A/D 16x10b; D/A 1x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 100-TFBGA (9x9) 100-TFBGA (9x9)
Top