ATSAM3S1BB-MU vs ATSAM3S2BA-MUR

This detailed comparison of ATSAM3S1BB-MU and ATSAM3S2BA-MUR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3S1BB-MU

Roving Networks / Microchip Technology

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ATSAM3S2BA-MUR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Description	IC MCU 32BIT 64KB FLASH 64QFN	IC MCU 32BIT 128KB FLASH 64QFN
In Stock	169	5 482
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3S	SAM3S
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	64MHz	64MHz
Connectivity	I²C, MMC, SPI, SSC, UART/USART, USB	I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	47	47
Program Memory Size	64KB (64K x 8)	128KB (128K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	16K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 10x10/12b; D/A 2x12b	A/D 10x10/12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-QFN (9x9)	64-QFN (9x9)