ATSAM3S1CB-CUR vs ATSAM3N1CB-CUR

This detailed comparison of ATSAM3S1CB-CUR and ATSAM3N1CB-CUR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3S1CB-CUR

Roving Networks / Microchip Technology

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ATSAM3N1CB-CUR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT 64KB FLASH 100TFBGA	IC MCU 32BIT 64KB FLASH 100TFBGA
In Stock	1 745	2 893
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3S	SAM3N
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	64MHz	48MHz
Connectivity	EBI/EMI, I²C, Memory Card, SPI, SSC, UART/USART, USB	I²C, IrDA, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	79	79
Program Memory Size	64KB (64K x 8)	64KB (64K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	16K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 15x10/12b; D/A 2x12b	A/D 16x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)