ATSAM3S2BA-AUR vs TMPM332FWUG(C)

This detailed comparison of ATSAM3S2BA-AUR and TMPM332FWUG(C) in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3S2BA-AUR

Roving Networks / Microchip Technology

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TMPM332FWUG(C)

Toshiba Electronic Devices and Storage Corporation

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Toshiba Electronic Devices and Storage Corporation
Package / Case	64-LQFP	64-LQFP
Description	IC MCU 32BIT 128KB FLASH 64LQFP	IC MCU 32BIT 128KB FLASH 64LQFP
In Stock	1 490	4 504
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3S	TX03
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	64MHz	40MHz
Connectivity	I²C, MMC, SPI, SSC, UART/USART, USB	I²C, SIO, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	POR, WDT
Number of I/O	47	44
Program Memory Size	128KB (128K x 8)	128KB (128K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	32K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	2.7V ~ 3.6V
Data Converters	A/D 10x10/12b; D/A 2x12b	A/D 8x10b
Oscillator Type	Internal	External
Operating Temperature	-40°C ~ 85°C (TA)	-20°C ~ 85°C (TA)
Supplier Device Package	64-LQFP (10x10)	64-LQFP (10x10)