ATSAM3S4AA-MU vs LM3S612-IGZ50-C2T

This detailed comparison of ATSAM3S4AA-MU and LM3S612-IGZ50-C2T in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3S4AA-MU

Roving Networks / Microchip Technology

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LM3S612-IGZ50-C2T

Texas Instruments

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Texas Instruments
Package / Case	48-VFQFN Exposed Pad	48-VFQFN Exposed Pad
Description	IC MCU 32BIT 256KB FLASH 48QFN	IC MCU 32BIT 32KB FLASH 48VQFN
In Stock	5 499	2 350
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Discontinued at Digi-Key
Series	SAM3S	Stellaris® ARM® Cortex®-M3S 600
Package	Tray	Tape & Reel (TR)
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	64MHz	50MHz
Connectivity	I²C, MMC, SPI, SSC, UART/USART, USB	I²C, Microwire, SPI, SSI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	34	34
Program Memory Size	256KB (256K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	48K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 8x10/12b	A/D 2x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	48-QFN (7x7)	48-VQFN (7x7)