ATSAM3U2EA-AU vs LPC18S10FBD144E

This detailed comparison of ATSAM3U2EA-AU and LPC18S10FBD144E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3U2EA-AU

Roving Networks / Microchip Technology

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LPC18S10FBD144E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	NXP Semiconductors
Package / Case	144-LQFP	144-LQFP
Description	IC MCU 32BIT 128KB FLASH 144LQFP	IC MCU 32BIT ROMLESS 144LQFP
In Stock	248	60
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3U	LPC18xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	96MHz	180MHz
Connectivity	EBI/EMI, I²C, Memory Card, SPI, SSC, UART/USART, USB	CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	96	83
Program Memory Size	128KB (128K x 8)	-
Program Memory Type	FLASH	ROMless
EEPROM Size	-	-
RAM Size	36K x 8	136K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 8x10b, 8x12b	A/D 8x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	144-LQFP (20x20)	144-LQFP (20x20)