ATSAM3X8EA-CU vs STM32F103ZDH6TR

This detailed comparison of ATSAM3X8EA-CU and STM32F103ZDH6TR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3X8EA-CU

Roving Networks / Microchip Technology

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STM32F103ZDH6TR

STMicroelectronics

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	STMicroelectronics
Package / Case	144-LFBGA	144-LFBGA
Description	IC MCU 32BIT 512KB FLASH 144BGA	IC MCU 32BIT 384KB FLSH 144LFBGA
In Stock	2 980	1 984
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3X	STM32F1
Package	Tray	Tape & Reel (TR)
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	84MHz	72MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, Memory Card, SPI, SSC, UART/USART, USB	CANbus, I²C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number of I/O	103	112
Program Memory Size	512KB (512K x 8)	384KB (384K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	100K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	2V ~ 3.6V
Data Converters	A/D 16x12b; D/A 2x12b	A/D 21x12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	144-BGA (13x13)	144-LFBGA (10x10)