ATSAMG53N19B-AU vs MK50DN512CLL10

This detailed comparison of ATSAMG53N19B-AU and MK50DN512CLL10 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAMG53N19B-AU

Roving Networks / Microchip Technology

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MK50DN512CLL10

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	NXP Semiconductors
Package / Case	100-LQFP	100-LQFP
Description	IC MCU 32BIT 512KB FLASH 100LQFP	IC MCU 32BIT 512KB FLASH 100LQFP
In Stock	3 708	450
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM G53	Kinetis K50
Package	TrayTray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	48MHz	100MHz
Connectivity	I²C, SPI, UART/USART	EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals	DMA, I²S, POR, PWM, WDT	DMA, I²S, LVD, POR, PWM, WDT
Number of I/O	38	59
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	96K x 8	128K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 8x12b	A/D 34x16b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-LQFP (14x14)	100-LQFP (14x14)