C8051T602-GM vs C8051T605-GMR

This detailed comparison of C8051T602-GM and C8051T605-GMR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

C8051T602-GM

C8051T602-GM

Silicon Labs

C8051T605-GMR

C8051T605-GMR

Silicon Labs

Specifications
Manufacturer Silicon Labs Silicon Labs
Package / Case 10-VFDFN Exposed Pad 10-VFDFN Exposed Pad
Description IC MCU 8BIT 4KB OTP 11QFN IC MCU 8BIT 2KB OTP 11QFN
In Stock 301 784
Mounting Type Surface Mount Surface Mount
Part Status Not For New Designs Not For New Designs
Series C8051T60x C8051T60x
Package Tube Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor 8051 8051
Core Size 8-Bit 8-Bit
Speed 25MHz 25MHz
Connectivity SMBus (2-Wire/I²C), UART/USART SMBus (2-Wire/I²C), UART/USART
Peripherals POR, PWM, Temp Sensor, WDT POR, PWM, WDT
Number of I/O 8 8
Program Memory Size 4KB (4K x 8) 2KB (2K x 8)
Program Memory Type OTP OTP
EEPROM Size - -
RAM Size 256 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b -
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 11-QFN (3x3) 11-QFN (3x3)
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