C8051T605-GMR vs C8051T602-GM

This detailed comparison of C8051T605-GMR and C8051T602-GM in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

C8051T605-GMR

C8051T605-GMR

Silicon Labs

C8051T602-GM

C8051T602-GM

Silicon Labs

Specifications
Manufacturer Silicon Labs Silicon Labs
Package / Case 10-VFDFN Exposed Pad 10-VFDFN Exposed Pad
Description IC MCU 8BIT 2KB OTP 11QFN IC MCU 8BIT 4KB OTP 11QFN
In Stock 784 301
Mounting Type Surface Mount Surface Mount
Part Status Not For New Designs Not For New Designs
Series C8051T60x C8051T60x
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tube
Core Processor 8051 8051
Core Size 8-Bit 8-Bit
Speed 25MHz 25MHz
Connectivity SMBus (2-Wire/I²C), UART/USART SMBus (2-Wire/I²C), UART/USART
Peripherals POR, PWM, WDT POR, PWM, Temp Sensor, WDT
Number of I/O 8 8
Program Memory Size 2KB (2K x 8) 4KB (4K x 8)
Program Memory Type OTP OTP
EEPROM Size - -
RAM Size 256 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters - A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 11-QFN (3x3) 11-QFN (3x3)
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