CY8C6316BZI-BLF03 vs CY8C6316BZI-BLF53

This detailed comparison of CY8C6316BZI-BLF03 and CY8C6316BZI-BLF53 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

CY8C6316BZI-BLF03

Cypress Semiconductor

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CY8C6316BZI-BLF53

Cypress Semiconductor

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Specifications Hide identical items

Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Package / Case	116-WFBGA	116-WFBGA
Description	IC MCU 32BIT 512KB FLASH 116BGA	IC MCU 32BIT 512KB FLASH 116BGA
In Stock	4 113	1 101
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	PSoC® 6 BLE	PSoC® 6 BLE
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	50MHz	50MHz
Connectivity	I²C, LINbus, QSPI, SPI, UART/USART, USB	I²C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals	Bluetooth, Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT	Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O	78	78
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	160K x 8	160K x 8
Voltage - Supply (Vcc/Vdd)	1.7V ~ 3.6V	1.7V ~ 3.6V
Data Converters	A/D 8x12b SAR; D/A 1x12b	A/D 8x12b SAR; D/A 1x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	116-BGA (5.2x6.4)	116-BGA (5.2x6.4)