CY9BF168NBGL-GE1 vs MB9BF568NBGL-GE1

This detailed comparison of CY9BF168NBGL-GE1 and MB9BF568NBGL-GE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

CY9BF168NBGL-GE1

CY9BF168NBGL-GE1

Cypress Semiconductor

MB9BF568NBGL-GE1

MB9BF568NBGL-GE1

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 112-LFBGA 112-LFBGA
Description IC MCU 32BIT 1.03125MB 112FBGA IC MCU 32BIT 1.03125MB 112FBGA
In Stock 2 220 5 000
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series FM4 MB9B160R FM4 MB9B560R
Package Tray Tray
Core Processor ARM® Cortex®-M4F ARM® Cortex®-M4F
Core Size 32-Bit 32-Bit
Speed 160MHz 160MHz
Connectivity CSIO, I²C, LINbus, UART/USART CANbus, CSIO, EBI/EMI, I²C, LINbus, SD, UART/USART, USB
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 80 80
Program Memory Size 1.03125MB (1.03125M x 8) 1.03125MB (1.03125M x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 128K x 8 128K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 24x12b; D/A 2x12b A/D 24x12b; D/A 2x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 112-FBGA (7x7) 112-FBGA (7x7)
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