D6417709SF133BV vs HD6417705F133V

This detailed comparison of D6417709SF133BV and HD6417705F133V in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

D6417709SF133BV

D6417709SF133BV

Renesas Electronics America

HD6417705F133V

HD6417705F133V

VIGOR

Specifications
Manufacturer Renesas Electronics America VIGOR
Package / Case 208-LQFP 208-LQFP
Description IC MCU 32BIT ROMLESS 208LQFP IC MCU 32BIT ROMLESS 208LQFP
In Stock 10 120 511
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series SuperH® SH7700 SuperH® SH7700
Package Tray Tray
Core Processor SH-3 SH-3
Core Size 32-Bit 32-Bit
Speed 133MHz 133MHz
Connectivity EBI/EMI, FIFO, IrDA, SCI, SmartCard EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals DMA, POR, WDT DMA, POR, PWM, WDT
Number of I/O 96 105
Program Memory Size - -
Program Memory Type ROMless ROMless
EEPROM Size - -
RAM Size 16K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 1.65V ~ 2.05V 1.4V ~ 1.6V
Data Converters A/D 8x10b; D/A 2x8b A/D 4x10b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Supplier Device Package 208-LQFP (28x28) 208-LQFP (28x28)
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