DF2266FA13V vs DF2258FA13IV

This detailed comparison of DF2266FA13V and DF2258FA13IV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF2266FA13V

Renesas Electronics America

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DF2258FA13IV

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	100-BFQFP	100-BFQFP
Description	IC MCU 16BIT 128KB FLASH 100QFP	IC MCU 16BIT 256KB FLASH 100QFP
In Stock	187	598
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	H8® H8S/2200	H8® H8S/2200
Package	Tray	Tray
Core Processor	H8S/2000	H8S/2000
Core Size	16-Bit	16-Bit
Speed	13MHz	13MHz
Connectivity	I²C, SCI, SmartCard	I²C, SCI, SmartCard
Peripherals	LCD, POR, PWM, WDT	POR, PWM, WDT
Number of I/O	67	72
Program Memory Size	128KB (128K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	16K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	2.7V ~ 3.6V
Data Converters	A/D 10x10b	A/D 6x10b; D/A 2x8b
Oscillator Type	Internal	Internal
Operating Temperature	-20°C ~ 75°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-QFP (14x14)	100-QFP (14x14)