DF2357TE20IV vs DF2329BVTE25WV

This detailed comparison of DF2357TE20IV and DF2329BVTE25WV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF2357TE20IV

Renesas Electronics America

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DF2329BVTE25WV

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	120-TQFP	120-TQFP
Description	IC MCU 16BIT 128KB FLASH 120TQFP	IC MCU 16BIT 384KB FLASH 120TQFP
In Stock	689	174
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	H8® H8S/2300	H8® H8S/2300
Package	Tray	Tray
Core Processor	H8S/2000	H8S/2000
Core Size	16-Bit	16-Bit
Speed	20MHz	25MHz
Connectivity	SCI, SmartCard	SCI, SmartCard
Peripherals	DMA, POR, PWM, WDT	DMA, POR, PWM, WDT
Number of I/O	87	86
Program Memory Size	128KB (128K x 8)	384KB (384K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	4.5V ~ 5.5V	2.7V ~ 3.6V
Data Converters	A/D 8x10b; D/A 2x8b	A/D 8x10b; D/A 2x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	120-TQFP (14x14)	120-TQFP (14x14)