DF36012GFXV vs HD64F3664FYV

This detailed comparison of DF36012GFXV and HD64F3664FYV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF36012GFXV

DF36012GFXV

Renesas Electronics America

HD64F3664FYV

HD64F3664FYV

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 48-LQFP 48-LQFP
Description IC MCU 16BIT 16KB FLASH 48LQFP IC MCU 16BIT 32KB FLASH 48LQFP
In Stock 168 164
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series H8® H8/300H Tiny H8® H8/300H Tiny
Package Tray Tray
Core Processor H8/300H H8/300H
Core Size 16-Bit 16-Bit
Speed 20MHz 16MHz
Connectivity SCI I²C, SCI
Peripherals LVD, POR, PWM, WDT PWM, WDT
Number of I/O 30 29
Program Memory Size 16KB (16K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 4x10b A/D 8x10b
Oscillator Type Internal External
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Supplier Device Package 48-LQFP (10x10) 48-LQFP (10x10)
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