DF36037GHV vs HD64F3687GHV

This detailed comparison of DF36037GHV and HD64F3687GHV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF36037GHV

Renesas Electronics America

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HD64F3687GHV

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	64-BQFP	64-BQFP
Description	IC MCU 16BIT 56KB FLASH 64QFP	IC MCU 16BIT 56KB FLASH 64QFP
In Stock	200	288
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	H8® H8/300H Tiny	H8® H8/300H Tiny
Package	Tray	Tray
Core Processor	H8/300H	H8/300H
Core Size	16-Bit	16-Bit
Speed	20MHz	20MHz
Connectivity	CANbus, SCI, SSU	I²C, SCI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	45	45
Program Memory Size	56KB (56K x 8)	56KB (56K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	3K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-20°C ~ 75°C (TA)	-20°C ~ 75°C (TA)
Supplier Device Package	64-QFP (14x14)	64-QFP (14x14)