DF36094GHV vs HD6433664B75HV

This detailed comparison of DF36094GHV and HD6433664B75HV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF36094GHV

Renesas Electronics America

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HD6433664B75HV

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	64-BQFP	64-BQFP
Description	IC MCU 16BIT 32KB FLASH 64QFP	IC MCU 16BIT 32KB MROM 64QFP
In Stock	704	129
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	H8® H8/300H Tiny	H8® H8/300H Tiny
Package	Bulk	Tray
Core Processor	H8/300H	H8/300H
Core Size	16-Bit	16-Bit
Speed	20MHz	16MHz
Connectivity	I²C, SCI	I²C, SCI, UART/USART
Peripherals	LVD, POR, PWM, WDT	DMA, PWM, WDT
Number of I/O	31	29
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	Mask ROM
EEPROM Size	-	-
RAM Size	2K x 8	1K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-20°C ~ 75°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-QFP (14x14)	64-QFP (14x14)