DF38444XWV vs DF38444WWV

This detailed comparison of DF38444XWV and DF38444WWV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF38444XWV

Renesas Electronics America

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DF38444WWV

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	100-TQFP	100-TQFP
Description	IC MCU 8BIT 32KB FLASH 100TQFP	IC MCU 8BIT 32KB FLASH 100TQFP
In Stock	248	268
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	H8® H8/300L SLP	H8® H8/300L SLP
Package	Tray	Tray
Core Processor	H8/300L	H8/300L
Core Size	8-Bit	8-Bit
Speed	8MHz	8MHz
Connectivity	CSI, SPI, UART/USART	CSI, SPI, UART/USART
Peripherals	LCD, PWM, WDT	LCD, PWM, WDT
Number of I/O	71	71
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	2K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 5.5V	1.8V ~ 5.5V
Data Converters	A/D 12x12b	A/D 12x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TQFP (14x14)	100-TQFP (12x12)