DSPIC30F2011-20E/P vs DSPIC33FJ16GP101-E/P

This detailed comparison of DSPIC30F2011-20E/P and DSPIC33FJ16GP101-E/P in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC30F2011-20E/P

Roving Networks / Microchip Technology

Request For Quote

DSPIC33FJ16GP101-E/P

Roving Networks / Microchip Technology

Request For Quote

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	18-DIP (0.300", 7.62mm)	18-DIP (0.300", 7.62mm)
Description	IC MCU 16BIT 12KB FLASH 18DIP	IC MCU 16BIT 16KB FLASH 18DIP
In Stock	948	690
Mounting Type	Through Hole	Through Hole
Part Status	Active	Obsolete
Series	dsPIC™ 30F	Automotive, AEC-Q100, dsPIC™ 33F
Package	Tube	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	20 MIPS	16 MIPs
Connectivity	I²C, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	12	13
Program Memory Size	12KB (4K x 24)	16KB (16K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	1K x 8	1K x 8
Voltage - Supply (Vcc/Vdd)	2.5V ~ 5.5V	3V ~ 3.6V
Data Converters	A/D 8x12b	A/D 4x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	18-PDIP	18-PDIP