DSPIC30F2020-30I/MMB32 vs DSPIC33FJ16GP102T-I/ML

This detailed comparison of DSPIC30F2020-30I/MMB32 and DSPIC33FJ16GP102T-I/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC30F2020-30I/MMB32

DSPIC30F2020-30I/MMB32

Roving Networks / Microchip Technology

DSPIC33FJ16GP102T-I/ML

DSPIC33FJ16GP102T-I/ML

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-VQFN Exposed Pad 28-VQFN Exposed Pad
Description IC MCU 16BIT 12KB FLASH 28QFN IC MCU 16BIT 16KB FLASH 28QFN
In Stock 595 218
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series dsPIC™ 30F dsPIC™ 33F
Package Tube Tape & Reel (TR)
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 30 MIPs 16 MIPs
Connectivity I²C, IrDA, LINbus, SPI, UART/USART I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 21 21
Program Memory Size 12KB (4K x 24) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 512 x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 3.6V
Data Converters A/D 8x10b A/D 6x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-QFN-S (6x6) 28-QFN (6x6)
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