DSPIC30F3010-20E/SP vs DSPIC33EP32MC202-E/SP

This detailed comparison of DSPIC30F3010-20E/SP and DSPIC33EP32MC202-E/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC30F3010-20E/SP

Roving Networks / Microchip Technology

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DSPIC33EP32MC202-E/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 16BIT 24KB FLASH 28SPDIP	IC MCU 16BIT 32KB FLASH 28SPDIP
In Stock	806	468
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	dsPIC™ 30F	Automotive, AEC-Q100, dsPIC™ 33EP
Package	Tube	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	20 MIPS	60 MIPs
Connectivity	I²C, SPI, UART/USART	I²C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT	Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O	20	21
Program Memory Size	24KB (8K x 24)	32KB (10.7K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	1K x 8	-
RAM Size	1K x 8	2K x 16
Voltage - Supply (Vcc/Vdd)	2.5V ~ 5.5V	3V ~ 3.6V
Data Converters	A/D 6x10b	A/D 6x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP