DSPIC30F3010-30I/SP vs DSPIC30F3013-20E/SP

This detailed comparison of DSPIC30F3010-30I/SP and DSPIC30F3013-20E/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC30F3010-30I/SP

DSPIC30F3010-30I/SP

Roving Networks / Microchip Technology

DSPIC30F3013-20E/SP

DSPIC30F3013-20E/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 16BIT 24KB FLASH 28SPDIP IC MCU 16BIT 24KB FLASH 28SPDIP
In Stock 832 140
Mounting Type Through Hole Through Hole
Part Status Active Active
Series dsPIC™ 30F dsPIC™ 30F
Package Tube Tube
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 30 MIPs 20 MIPS
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 20 20
Program Memory Size 24KB (8K x 24) 24KB (8K x 24)
Program Memory Type FLASH FLASH
EEPROM Size 1K x 8 1K x 8
RAM Size 1K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 2.5V ~ 5.5V 2.5V ~ 5.5V
Data Converters A/D 6x10b A/D 10x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
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