DSPIC30F3014T-20E/ML vs DSPIC33EP32GS504-E/ML

This detailed comparison of DSPIC30F3014T-20E/ML and DSPIC33EP32GS504-E/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC30F3014T-20E/ML

Roving Networks / Microchip Technology

Request For Quote

DSPIC33EP32GS504-E/ML

Roving Networks / Microchip Technology

Request For Quote

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	44-VQFN Exposed Pad	44-VQFN Exposed Pad
Description	IC MCU 16BIT 24KB FLASH 44QFN	IC MCU 16BIT 32KB FLASH 44QFN
In Stock	166	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	dsPIC™ 30F	Automotive, AEC-Q100, dsPIC™ 33EP, Functional Safety (FuSa)
Package	Tape & Reel (TR)	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	20 MIPS	60 MIPs
Connectivity	I²C, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	30	35
Program Memory Size	24KB (8K x 24)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	1K x 8	-
RAM Size	2K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	2.5V ~ 5.5V	3V ~ 3.6V
Data Converters	A/D 13x12b	A/D 19x12b; D/A 1x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	44-QFN (8x8)	44-QFN (8x8)