DSPIC30F4013T-20E/ML vs DSPIC33EP64GS804-E/ML

This detailed comparison of DSPIC30F4013T-20E/ML and DSPIC33EP64GS804-E/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC30F4013T-20E/ML

Roving Networks / Microchip Technology

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DSPIC33EP64GS804-E/ML

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	44-VQFN Exposed Pad	44-VQFN Exposed Pad
Description	IC MCU 16BIT 48KB FLASH 44QFN	IC MCU 16BIT 64KB FLASH 44QFN
In Stock	636	253
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	dsPIC™ 30F	Automotive, AEC-Q100, dsPIC™ 33EP, Functional Safety (FuSa)
Package	Tape & Reel (TR)	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	20 MIPS	60 MIPs
Connectivity	CANbus, I²C, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	AC'97, Brown-out Detect/Reset, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	30	33
Program Memory Size	48KB (16K x 24)	64KB (64K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	1K x 8	-
RAM Size	2K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	2.5V ~ 5.5V	3V ~ 3.6V
Data Converters	A/D 13x12b	A/D 17x12b; D/A 1x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	44-QFN (8x8)	44-QFN (8x8)