DSPIC33CK32MP206-E/MR vs DSPIC33EV32GM006-E/MR

This detailed comparison of DSPIC33CK32MP206-E/MR and DSPIC33EV32GM006-E/MR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33CK32MP206-E/MR

Roving Networks / Microchip Technology

Request For Quote

DSPIC33EV32GM006-E/MR

Roving Networks / Microchip Technology

Request For Quote

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Description	IC MCU 16BIT 32KB FLASH 64QFN	IC MCU 16BIT 32KB FLASH 64VQFN
In Stock	366	129
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Automotive, AEC-Q100, dsPIC™ 33CK, Functional Safety (FuSa)	Automotive, AEC-Q100, dsPIC™ 33EV, Functional Safety (FuSa)
Package	Tube	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	100MHz	60 MIPs
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT	Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O	53	53
Program Memory Size	32KB (32K x 8)	32KB (11K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	4.5V ~ 5.5V
Data Converters	A/D 20x12b; D/A 3x12b	A/D 36x10/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	64-QFN (9x9)	64-VQFN (9x9)