DSPIC33EP512GM604-H/ML vs DSPIC33EP512GP504-I/ML

This detailed comparison of DSPIC33EP512GM604-H/ML and DSPIC33EP512GP504-I/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP512GM604-H/ML

Roving Networks / Microchip Technology

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DSPIC33EP512GP504-I/ML

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	44-VQFN Exposed Pad	44-VQFN Exposed Pad
Description	IC MCU 16BIT 512KB FLASH 44QFN	IC MCU 16BIT 512KB FLASH 44QFN
In Stock	328	423
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Automotive, AEC-Q100, dsPIC™ 33EP	dsPIC™ 33EP
Package	Tube	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	-	70 MIPs
Connectivity	CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART	CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	35	35
Program Memory Size	512KB (170K x 24)	512KB (170K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	48K x 8	24K x 16
Voltage - Supply (Vcc/Vdd)	-	3V ~ 3.6V
Data Converters	A/D 18x10b/12b	A/D 9x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 150°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	44-QFN (8x8)	44-QFN (8x8)