DSPIC33EP64GP502T-E/MM vs DSPIC33FJ64GP802-H/MM

This detailed comparison of DSPIC33EP64GP502T-E/MM and DSPIC33FJ64GP802-H/MM in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP64GP502T-E/MM

Roving Networks / Microchip Technology

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DSPIC33FJ64GP802-H/MM

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-VQFN Exposed Pad	28-VQFN Exposed Pad
Description	IC MCU 16BIT 64KB FLASH 28QFN	IC MCU 16BIT 64KB FLASH 28QFN
In Stock	982	523
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	Automotive, AEC-Q100, dsPIC™ 33EP	Automotive, AEC-Q100, dsPIC™ 33F
Package	Tape & Reel (TR)	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	60 MIPs	20 MIPS
Connectivity	CANbus, I²C, IrDA, LINbus, SPI, UART/USART	CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	Brown-out Detect/Reset, DCI, DMA, I²S, POR, PWM, WDT
Number of I/O	21	21
Program Memory Size	64KB (22K x 24)	64KB (64K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	4K x 16	16K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 6x10b/12b	A/D 10x10b/12b; D/A 2x16b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 150°C (TA)
Supplier Device Package	28-QFN-S (6x6)	28-QFN-S (6x6)