DSPIC33EP64GS708T-I/PT vs DSPIC30F5013T-20E/PT

This detailed comparison of DSPIC33EP64GS708T-I/PT and DSPIC30F5013T-20E/PT in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP64GS708T-I/PT

Roving Networks / Microchip Technology

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DSPIC30F5013T-20E/PT

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	80-TQFP	80-TQFP
Description	IC MCU 16BIT 64KB FLASH 80TQFP	IC MCU 16BIT 66KB FLASH 80TQFP
In Stock	379	260
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	dsPIC™ 33EP, Functional Safety (FuSa)	dsPIC™ 30F
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	70 MIPs	20 MIPS
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART	CANbus, I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number of I/O	67	68
Program Memory Size	64KB (64K x 8)	66KB (22K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	1K x 8
RAM Size	8K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	2.5V ~ 5.5V
Data Converters	A/D 22x12b; D/A 2x12b	A/D 16x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	80-TQFP (12x12)	80-TQFP (12x12)