DSPIC33FJ32GS610-E/PF vs DSPIC33FJ32GS610T-I/PT

This detailed comparison of DSPIC33FJ32GS610-E/PF and DSPIC33FJ32GS610T-I/PT in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33FJ32GS610-E/PF

Roving Networks / Microchip Technology

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DSPIC33FJ32GS610T-I/PT

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	100-TQFP	100-TQFP
Description	IC MCU 16BIT 32KB FLASH 100TQFP	IC MCU 16BIT 32KB FLASH 100TQFP
In Stock	194	144
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Obsolete
Series	Automotive, AEC-Q100, dsPIC™ 33F	dsPIC™ 33F
Package	Tray	Tape & Reel (TR)
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	40 MIPs	40 MIPs
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, QEI, POR, PWM, WDT	Brown-out Detect/Reset, QEI, POR, PWM, WDT
Number of I/O	85	85
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	4K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 24x10b; D/A 1x10b	A/D 24x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TQFP (14x14)	100-TQFP (12x12)