LM3S610-IGZ50-C2T vs ATSAM3N00AA-MUR

This detailed comparison of LM3S610-IGZ50-C2T and ATSAM3N00AA-MUR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LM3S610-IGZ50-C2T

Texas Instruments

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ATSAM3N00AA-MUR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Texas Instruments	Roving Networks / Microchip Technology
Package / Case	48-VFQFN Exposed Pad	48-VFQFN Exposed Pad
Description	IC MCU 32BIT 32KB FLASH 48VQFN	IC MCU 32BIT 16KB FLASH 48QFN
In Stock	6 016	2 990
Mounting Type	Surface Mount	Surface Mount
Part Status	Discontinued at Digi-Key	Active
Series	Stellaris® ARM® Cortex®-M3S 600	SAM3N
Package	Tape & Reel (TR)	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	50MHz	48MHz
Connectivity	I²C, Microwire, SPI, SSI, UART/USART	I²C, IrDA, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	34	34
Program Memory Size	32KB (32K x 8)	16KB (16K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 2x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	48-VQFN (7x7)	48-QFN (7x7)