LM3S6610-IBZ25-A2 vs LM3S6610-IBZ25-A2T

This detailed comparison of LM3S6610-IBZ25-A2 and LM3S6610-IBZ25-A2T in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LM3S6610-IBZ25-A2

LM3S6610-IBZ25-A2

Texas Instruments

LM3S6610-IBZ25-A2T

LM3S6610-IBZ25-A2T

Texas Instruments

Specifications
Manufacturer Texas Instruments Texas Instruments
Package / Case 108-LFBGA 108-LFBGA
Description IC MCU 32BIT 128KB FLASH 108BGA IC MCU 32BIT 128KB FLASH 108BGA
In Stock 2 500 1 314
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Stellaris® ARM® Cortex®-M3S 6000 Stellaris® ARM® Cortex®-M3S 6000
Package Tray Tape & Reel (TR)
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit 32-Bit
Speed 25MHz 25MHz
Connectivity Ethernet, I²C, IrDA, Microwire, QEI, SPI, SSI, UART/USART Ethernet, I²C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 46 46
Program Memory Size 128KB (128K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 2.25V ~ 2.75V 2.25V ~ 2.75V
Data Converters - -
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 108-BGA (10x10) 108-BGA (10x10)
Part Number Manufacturer Description Request For Quote
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