LM3S801-IGZ50-C2 vs TMPM3H2FSQG,A,EL

This detailed comparison of LM3S801-IGZ50-C2 and TMPM3H2FSQG,A,EL in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LM3S801-IGZ50-C2

Texas Instruments

Request For Quote

TMPM3H2FSQG,A,EL

Toshiba Electronic Devices and Storage Corporation

Request For Quote

Specifications Hide identical items

Manufacturer	Texas Instruments	Toshiba Electronic Devices and Storage Corporation
Package / Case	48-VFQFN Exposed Pad	48-VFQFN Exposed Pad
Description	IC MCU 32BIT 64KB FLASH 48VQFN	IC MCU 32BIT 16KB FLASH 48VQFN
In Stock	1 467	7 100
Mounting Type	Surface Mount	Surface Mount
Part Status	Discontinued at Digi-Key	Active
Series	Stellaris® ARM® Cortex®-M3S 800	-
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	50MHz	40MHz
Connectivity	I²C, Microwire, QEI, SPI, SSI, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	DMA, LVD, POR, WDT
Number of I/O	36	40
Program Memory Size	64KB (64K x 8)	16KB (16K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	2.7V ~ 5.5V
Data Converters	-	A/D 8x12b; D/A 1x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	48-VQFN (7x7)	48-VQFN (6x6)