LPC1111FHN33/103K vs LPC1111FHN331035

This detailed comparison of LPC1111FHN33/103K and LPC1111FHN331035 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1111FHN33/103K

NXP Semiconductors

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LPC1111FHN331035

VIGOR

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	VIGOR
Package / Case	32-VQFN Exposed Pad	32-VQFN Exposed Pad
Description	IC MCU 32BIT 8KB FLASH 32HVQFN	32-BIT ARM M3 CORE
In Stock	3 432	210
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	*	LPC1100L
Package	Bulk	Bulk
Core Processor	ARM® Cortex®-M0	ARM® Cortex®-M0
Core Size	32-Bit	32-Bit
Speed	50MHz	50MHz
Connectivity	I²C, SPI, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, WDT	Brown-out Detect/Reset, POR, WDT
Number of I/O	28	28
Program Memory Size	8KB (8K x 8)	8KB (8K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	2K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 8x10b SAR	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	32-HVQFN (7x7)	32-HVQFN (7x7)