LPC1114LVFHN24/103 vs XMC1302Q024F0032ABXUMA1

This detailed comparison of LPC1114LVFHN24/103 and XMC1302Q024F0032ABXUMA1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1114LVFHN24/103

LPC1114LVFHN24/103

NXP Semiconductors

XMC1302Q024F0032ABXUMA1

XMC1302Q024F0032ABXUMA1

IR (Infineon Technologies)

Specifications
Manufacturer NXP Semiconductors IR (Infineon Technologies)
Package / Case 24-VFQFN Exposed Pad 24-VFQFN Exposed Pad
Description IC MCU 32BIT 32KB FLASH 24HVQFN IC MCU 32BIT 32KB FLASH 24VQFN
In Stock 1 158 7 500
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series LPC1100LV XMC1000
Package Tray Tape & Reel (TR)
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit 32-Bit
Speed 50MHz 32MHz
Connectivity I²C, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, I²S, POR, PWM, WDT
Number of I/O 20 18
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 4K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V 1.8V ~ 5.5V
Data Converters A/D 8x8b A/D 13x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 24-HVQFN (4x4) PG-VQFN-24-19
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