LPC11A12FHN33/101, vs LPC11E14FHN33/401,

This detailed comparison of LPC11A12FHN33/101, and LPC11E14FHN33/401, in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC11A12FHN33/101,

LPC11A12FHN33/101,

NXP Semiconductors

LPC11E14FHN33/401,

LPC11E14FHN33/401,

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 32-VQFN Exposed Pad 32-VQFN Exposed Pad
Description IC MCU 32BIT 16KB FLASH 32HVQFN IC MCU 32BIT 32KB FLASH 32HVQFN
In Stock 145 140
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series LPC11Axx LPC11Exx
Package Tray Tray
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit 32-Bit
Speed 50MHz 50MHz
Connectivity I²C, Microwire, SPI, SSI, SSP, UART/USART I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 28 28
Program Memory Size 16KB (16K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 1K x 8 4K x 8
RAM Size 4K x 8 10K x 8
Voltage - Supply (Vcc/Vdd) 2.6V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 32-HVQFN (7x7) 32-HVQFN (7x7)
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