LPC11A13FHI33/201, vs LPC1114FHI33/302,5

This detailed comparison of LPC11A13FHI33/201, and LPC1114FHI33/302,5 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC11A13FHI33/201,

NXP Semiconductors

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LPC1114FHI33/302,5

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	32-VFQFN Exposed Pad	32-VFQFN Exposed Pad
Description	IC MCU 32BIT 24KB FLASH 32HVQFN	IC MCU 32BIT 32KB FLASH 32HVQFN
In Stock	404	825
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC11Axx	LPC1100L
Package	Tray	Tray
Core Processor	ARM® Cortex®-M0	ARM® Cortex®-M0
Core Size	32-Bit	32-Bit
Speed	50MHz	50MHz
Connectivity	I²C, Microwire, SPI, SSI, SSP, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, WDT	Brown-out Detect/Reset, POR, WDT
Number of I/O	28	28
Program Memory Size	24KB (24K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	2K x 8	-
RAM Size	6K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	2.6V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 8x10b; D/A 1x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	32-HVQFN (5x5)	32-HVQFN (5x5)