LPC11E14FHN33/401, vs LPC1114FHN33/302K

This detailed comparison of LPC11E14FHN33/401, and LPC1114FHN33/302K in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC11E14FHN33/401,

NXP Semiconductors

Request For Quote

LPC1114FHN33/302K

NXP Semiconductors

Request For Quote

Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	32-VQFN Exposed Pad	32-VQFN Exposed Pad
Description	IC MCU 32BIT 32KB FLASH 32HVQFN	IC MCU 32BIT 32KB FLASH 32HVQFN
In Stock	140	2 111
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC11Exx	LPC1100L
Package	Tray	Tray
Core Processor	ARM® Cortex®-M0	ARM® Cortex®-M0
Core Size	32-Bit	32-Bit
Speed	50MHz	50MHz
Connectivity	I²C, Microwire, SPI, SSI, SSP, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, WDT	Brown-out Detect/Reset, POR, WDT
Number of I/O	28	28
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	4K x 8	-
RAM Size	10K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 8x10b	A/D 8x10b SAR
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	32-HVQFN (7x7)	32-HVQFN (7x7)